Application Type
Application SubType
National Application
(10) Registration Number and Date
Status
ACTIVE ( Other event occurred)
(18) Expiration Date
2041.03.11
(20) Filing Number and Date
30202600233S 2026.03.11
(400) Publication Number and Date
(71/73) Applicant
(72) Designer
(74) Representative
(EN) RODYK IP : 80 RAFFLES PLACE #32-32 UOB PLAZA 1 Singapore 048624
(54) Design Title
(EN)
Description
SEMICONDUCTOR DIE BONDER
SEMICONDUCTOR DIE BONDER
(EN) SEMICONDUCTOR DIE BONDER
(57) Design Novelty Statement
(EN) Novelty resides in the Shape and Configuration as shown in the Representation(s).
(56) Design Claims
| Claim | Description |
|---|
(70) License Details