Application Type
Single
Application SubType
-
(10) Registration Number and Date
MY 25-E1784-0101 2026.02.27
Status
ACTIVE ( IP right granted)
(18) Expiration Date
2030.03.03
(20) Filing Number and Date
25-E1784-0101 2025.08.29
(400) Publication Number and Date
(30) Priority Details
JP
JPJAPAN APPLICATION NO. 2025-004153 D
2025.03.03
(51/52) Classification
(72) Designer
(EN) YOSHIDA, Shojiro : c/o SHIN-ETSU POLYMER CO., LTD., 406-1, Yoshinocho 1-chome, Kita-ku, Saitama-shi, Saitama 3310811
(74) Representative
(EN) PATRICK MIRANDAH : C/O MIRANDAH ASIA (MALAYSIA) SDN. BHD. SUITE 3B-19-3, LEVEL 19, BLOCK 3B, PLAZA SENTRAL, JALAN STESEN SENTRAL 5, 50470 Wilayah Persekutuan
(54) Design Title
Description
This product is a dicing frame for holding a substrate to be cut by means of a dicing tape fixed separately at the opening portion.
(EN) DICING FRAME
(57) Design Novelty Statement
(56) Design Claims
| Claim | Description |
|---|
(70) License Details
