Application Type
National Patent
Application SubType
(10) Registration Number and Date
Status
ACTIVE ( Other event occurred)
(180) Expiration Date
(20) Filing Number and Date
MY PI2025005730 2025.09.22
(40) Publication Number (Gazette Number) and Date
(85) National Entry Date
(30) Priority Details
JP
JP2024-169239
2024.09.27
(51) IPC Classes
(71/73) Applicant
(72) Inventor
(74) Representative
(EN) LINDA WANG CHAW LING : C/O LINDA WANG SU & BOO (a member of Zico IP) LEVEL 7 MENARA MILENIUM, JALAN DAMANLELA, PUSAT BANDAR DAMANSARA, 50490 Wilayah Persekutuan
(54) Title
(EN) POLISHING COMPOSITION, METHOD FOR PRODUCING SUBSTRATE AND POLISHING METHOD
(57) Abstract
(EN) Provided is a polishing composition that includes a silica abrasive and can maintain low micro-waviness while achieving superior removal ability. A polishing composition for a magnetic disk substrate is provided. The polishing composition includes silica particles as an abrasive, an acid and an oxidant. Here, the silica particles have a 25th percentile aspect ratio of 1.30 or lower and a 75th percentile aspect ratio of 1.20 or higher and 3.00 or lower in its volume-based aspect ratio distribution.
(58) Citations
License Details
(98) Annuity Details
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