Application Type
National Patent
Application SubType
(10) Registration Number and Date
Status
ACTIVE ( Other event occurred)
(180) Expiration Date
(20) Filing Number and Date
MY PI2025001922 2025.03.27
(40) Publication Number and Date
(85) National Entry Date
(30) Priority Details
JP
JP2024-058115
2024.03.29
JP2025-037509
2025.03.10
(51) IPC Classes
(72) Inventor
(EN) SHIHO IDO : c/o ASAHI KASEI KABUSHIKI KAISHA, 1-1-2 Yurakucho, Chiyoda-ku, Tokyo 100-0006
YUKI MATSUO
(74) Representative
(EN) ANDREW SIEW ONN THIUN : C/O HENRY GOH & CO. SDN. BHD., VO2-10-06 LINGKARAN SV, SUNWAY VELOCITY, JALAN PEEL 55100 KUALA LUMPUR
(54) Title
(EN) PHOTOSENSITIVE RESIN MULTILAYER AND METHOD FOR ITS PRODUCTION
(57) Abstract
(EN) Provided is a photosensitive resin multilayer that can provide resist patterns satisfying the properties particularly required for resist patterns in recent years, and that can ensure quality stability over time. A photosensitive resin multilayer comprising a temporary support layer, a photosensitive resin layer containing a photosensitive resin composition, and a protective layer, wherein: the photosensitive resin composition includes the following components: (A) an alkali-soluble polymer, (B) a compound with an ethylenically unsaturated bond and (C) a photopolymerization initiator, the component (B) includes: (b1) a compound with a weight-average molecular weight of 540 or lower and having two or more ethylenically unsaturated bonds, and the photosensitive resin layer thickness tr (µm) and the protective layer thickness tp (µm) satisfy both of the following formulae: tp ≥ 25 (1) 1 ≤ tp/tr ≤ 3 (2). Fig. 1
(58) Citations
License Details
(98) Annuity Details
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