Application Type
National Patent
Application SubType
(10) Registration Number and Date
Status
ACTIVE ( Other event occurred)
(180) Expiration Date
(20) Filing Number and Date
MY PI2025003939 2025.06.30
(40) Publication Number and Date
${pbin}
(86) PCT Filing Number and Date
(87) PCT Publication Number and Date
(85) National Entry Date
(30) Priority Details
CN
CN202410551767.7
2024.04.30
(51) IPC Classes
    (71/73) Applicant
    (EN) JND ELECTRONIC TECHNOLOGY (WUHAN) CO., LTD. : Shenzhou Digital Wuhan Science and Technology Park, No. 7 Financial Port Road, Wuhan City, Hubei Province
    (72) Inventor
    (EN) Yun LU : Shenzhou Digital Wuhan Science and Technology Park, No. 7 Financial Port Road, Wuhan City, Hubei Province
    (74) Representative
    (EN) MOHANA MURALI A/L KODIVEL : C/O ADASTRA INTELLECTUAL PROPERTY SDN. BHD., A-39-10 PENTHOUSE, MENARA UOA BANGSAR, NO. 5, JALAN BANGSAR UTAMA 1, 59000 Wilayah Persekutuan
    (54) Title
    (EN) PLASTIC ENCAPSULATED INDUCTOR AND MANUFACTURING METHOD THEREOF AND POWER SUPPLY MODULE
    (57) Abstract
    (EN) The present application discloses a plastic encapsulated inductor and a manufac-turing method thereof and a power supply module, and relates to the field of power supply devices. The plastic encapsulated inductor includes an inductor assembly, a plas-tic encapsulated component and at least one conductor. The inductor assembly includes a magnetic core and a winding, the plastic encapsulated component is of an integrally formed structure and is disposed around a peripheral side of the magnetic core, and the at least one conductor is arranged on the peripheral side of the magnetic core. The at least one conductor is wrapped by the plastic encapsulated component or is jointly wrapped by the magnetic core and the plastic encapsulated component, and is provided with at least two connecting ends exposed out of surfaces of the plastic encapsulated component and/or the magnetic core.
    (58) Citations
    License Details
    (98) Annuity Details
    YearValidity StartValidity EndPayment
    Event NameDateLink
    Application filed2025-06-30
    Other event occurred2025-10-30