Application Type
National Patent
Application SubType
(10) Registration Number and Date
Status
ACTIVE ( Other event occurred)
(180) Expiration Date
(20) Filing Number and Date
MY PI2025001964 2025.03.28
(40) Publication Number and Date
(85) National Entry Date
(30) Priority Details
CN
CN2024103813074
2024.03.29
(51) IPC Classes
(71/73) Applicant
(72) Inventor
(EN) SONG, Jackie : City of Dreams (B-16-6), No. 1 Jalan Peter Paul Dason, Bandar, Seri Tanjung Pinang 10470 Tanjung Tokong
CHEN, Nathan : No. 5, Yueshan Road, Yuelai Street, Yubei District, Chongqing 401120
HA, Yongpeng : No. 1, Level 20, Building 22, 1122 Jingkai Avenue, Yubei District, Chongqing 401120
YANG, Dick : Room 2-1, Building 6, Shenghutianyu, Baoshenghu Street, Yubei District, Chongqing 401120
(74) Representative
(EN) GEETHA KANDIAH : C/O KASS INTERNATIONAL SDN. BHD., SUITE 8-13A-2, MENARA MUTIARA BANGSAR, JALAN LIKU OFF JALAN RIONG, BANGSAR, 59100 Wilayah Persekutuan
(54) Title
(EN) COMPONENT CARRIER, METHOD FOR MANUFACTURING OF A COMPONENT CARRIER AND PACKAGE
(57) Abstract
(EN) The present invention relates to a component carrier (100) comprising a stack with a stacking direction, an method for manufacturing thereof and a package with a component carrier (100), wherein said stack (30) comprises at least one electrically conductive layer structure, at least one electrically insulating structure, a first main surface (MS1) and a second main surface (MS2), wherein said first main surface (MS1) and said second main surface (MS2) are provided one above the other in stacking direction and being opposed one to each other, and a first lateral wall (W1) and a second lateral wall (W2) between said first and second main surfaces (MS1, MS2) connecting said opposed main surfaces (MS1, MS2). At least in a planarized state of said stack (30) in at least a first extension direction (ED) an extension (L1) of the first main surface (MS1) is different from an extension (L2) of the second main surface (MS2).
(58) Citations
License Details
(98) Annuity Details
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