A dispensing method including swiping and breaking an adhesive tail, relating to the field of semiconductor manufacturing technology. The method includes: providing a substrate; controlling a dispensing nozzle to move along a preset dispensing path; controlling the dispensing nozzle to stop dispensing adhesive and to move upward away from the substrate; controlling the dispensing nozzle to move along a swiping path. The swiping path includes a first swiping segment and a second swiping segment. While moving along the first swiping segment, the dispensing nozzle is controlled to move gradually downward toward the substrate. While moving along the second swiping segment, the dispensing nozzle is controlled to move gradually upward away from the substrate. The swiping path is added after the dispensing path, the dispensing nozzle moves gradually downward toward the substrate while moving along the first swiping path, the residual adhesive on the dispensing nozzle can be spread and adhered along the first swiping path, reducing the amount of the residual adhesive on the dispensing nozzle and minimizing an impact on a subsequent dispensing operation.