<?xml version="1.0" encoding="UTF-8"?>

<wo-patent-document lang="en" status="Filed" country="MY">
  <wo-bibliographic-data status="Under Preliminary Examination">
    <application-reference>
      <document-id>
        <country>MY</country>
        <doc-number>PI2025006934</doc-number>
        <date>20251107</date>
      </document-id>
    </application-reference>
    <priority-claims>
      <priority-claim sequence="0001" kind="national">
        <country>CN</country>
        <doc-number>202411588106.8</doc-number>
        <date>20241107</date>
      </priority-claim>
    </priority-claims>
    <parties>
      <applicants>
        <applicant sequence="0001" app-type="applicant" designation="all">
          <addressbook lang="en">
            <name>ASMPT SEMI Equipment (Shanghai) Co., Ltd.</name>
            <address>
              <address-1>Room 101, 1st Floor, Mezzanine Floor 1, Room 201, 2nd Floor, Mezzanine Floor 2, Room 301, 3rd Floor, Building 7, No. 99, 111 Boyi Road, Lingang Section of China (Shanghai) Pilot Free Trade Zone</address-1>
              <country>CN</country>
            </address>
          </addressbook>
          <nationality>
            <country/>
          </nationality>
          <residence>
            <country>CN</country>
          </residence>
        </applicant>
      </applicants>
      <inventors>
        <inventor sequence="0001">
          <addressbook lang="en">
            <name>LAM Wai Yip</name>
            <address>
              <address-1>19/F Gateway ts, 8 Cheung Fai Road, Tsing Yi, N.T., Hong Kong SAR</address-1>
              <country>CN</country>
            </address>
          </addressbook>
        </inventor>
        <inventor sequence="0002">
          <addressbook lang="en">
            <name>LAM Kui Kam</name>
            <address>
              <address-1>Room 101, 1st Floor, Mezzanine Floor 1, Room 201, 2nd Floor, Mezzanine Floor 2, Room 301, 3rd Floor, Building 7, No. 99, 111 Boyi Road, Lingang Section of China (Shanghai) Pilot Free Trade Zone</address-1>
              <country>CN</country>
            </address>
          </addressbook>
        </inventor>
        <inventor sequence="0003">
          <addressbook lang="en">
            <name>NG Tsz Fung</name>
            <address>
              <address-1>19/F Gateway ts, 8 Cheung Fai Road, Tsing Yi, N.T., Hong Kong SAR</address-1>
              <country>CN</country>
            </address>
          </addressbook>
        </inventor>
      </inventors>
      <agents>
        <agent sequence="0001" rep-type="agent">
          <addressbook lang="en">
            <name>ROSHAYATI BINTI ABDUL GHANI</name>
            <address>
              <address-1>C/O MESSRS DREWMARKS, PATENT &amp; DESIGNS (M) SDN. BHD., 9TH FLOOR, BANGUNAN GETAH ASLI (MENARA), 148 JALAN AMPANG, 50450 Wilayah Persekutuan</address-1>
              <country>MY</country>
            </address>
          </addressbook>
        </agent>
      </agents>
    </parties>
    <invention-title lang="en">DISPENSING METHOD</invention-title>
    <wo-national-office-event national-office-event-type="Filed" doc-number="PI2025006934" event-name="Filing">
      <wo-national-office-event-date>
        <date>20251107</date>
      </wo-national-office-event-date>
    </wo-national-office-event>
    <wo-national-office-event national-office-event-type="OPI" event-name="Open for public inspection">
      <wo-national-office-event-date>
        <date>20260507</date>
      </wo-national-office-event-date>
    </wo-national-office-event>
    <wo-national-office-filing-data appl-type="National Patent" file-type="">
      <kind-of-protection></kind-of-protection>
    </wo-national-office-filing-data>
  </wo-bibliographic-data>
  <abstract lang="en">
    <p num="0001">The present disclosure provides a dispensing method, including: providing a substrate; and applying an adhesive on a surface of the substrate along a preset dispensing path. The dispensing path includes a plurality of dispensing path sections including at least one curved path section, and at least a portion of the dispensing path includes a non-repetitive dispensing portion. A dispensing start point and a dispensing end point of the dispensing path are arranged at different positions on the surface of the substrate. As a dispensing process of the curved path section only requires one acceleration and deceleration of a dispensing nozzle, the at least one curved path section in the plurality of dispensing path sections can improve a dispensing speed and reduce a dispensing time. Further, reducing repetitive dispensing portion in the dispensing path can eliminate redundant repetitive dispensing so as to shorten the dispensing time.</p>
  </abstract>
</wo-patent-document>
